3D IC Integration and Packaging (Electronics) - download pdf or read online

By John H. Lau

A entire advisor to 3D IC integration and packaging technology

3D IC Integration and Packaging absolutely explains the most recent microelectronics strategies for expanding chip density and maximizing functionality whereas lowering strength intake. in line with a direction constructed by way of its writer, this functional consultant deals real-world problem-solving equipment and teaches the trade-offs inherent in making system-level judgements. discover key permitting applied sciences comparable to TSV, thin-wafer energy size and dealing with, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor picture sensors integration. meeting, thermal administration, and reliability are coated in entire detail.
3D IC Integration and Packaging covers:
3D integration for semiconductor IC packaging
Through-silicon vias modeling and testing
Stress sensors for thin-wafer dealing with and energy measurement
Package substrate technologies
Microbump fabrication, meeting, and reliability
3D Si integration
2.5D/3D IC integration
3D IC integration with passive interposer
Thermal administration of 2.5D/3D IC integration
Embedded 3D hybrid integration
3D LED and IC integration
3D MEMS and IC integration
3D CMOS picture sensors and IC integration
PoP, chip-to-chip interconnects, and embedded fan-out WLP

Show description

Read or Download 3D IC Integration and Packaging (Electronics) PDF

Similar electrical engineering books

Download e-book for kindle: FinFETs and Other Multi-Gate Transistors (Integrated by J.-P. Colinge (Ed.),J.-P. Colinge

This booklet explains the physics and houses of multi-gate field-effect transistors (MuGFETs), how they're made and the way circuit designers can use them to enhance the performances of built-in circuits. It covers the emergence of quantum results as a result of diminished measurement of the units and describes the evolution of the MOS transistor from classical buildings to SOI (silicon-on-insulator) after which to MuGFETs.

Real-Time UML Workshop for Embedded Systems (Embedded - download pdf or read online

Written as a workbook with a collection of guided routines that educate via instance, this publication offers a realistic, hands-on consultant to utilizing UML to layout and enforce embedded and real-time platforms. A overview of the fundamentals of UML and the concord approach for embedded software program improvement: on-going case examples to coach the techniques, a small-scale site visitors mild keep watch over process and a wide scale unmanned air car exhibit the functions of UML to the specification, research and layout of embedded and real-time platforms normally.

Fundamentos de Eletricidade - Volume 1: Corrente Continua e - download pdf or read online

O livro faz parte da série Habilidades Básicas em Eletricidade, Eletrônica e Telecomunicações, vencedora nos EUA. Aborda assuntos referentes às áreas da eletricidade, eletrônica e telecomunicações, contemplando cursos técnicos e tecnológicos. Possui fabric de apoio com resumos e questões adicionais em exclusivo ambiente digital de aprendizagem (clique no ícone de "Hotsite").

Download e-book for kindle: Heterostructures and Quantum Devices: Heterostructures and by Norman G. Einspruch,William R. Frensley

Heterostructure and quantum-mechanical units promise major development within the functionality of digital and optoelectronic built-in circuits (ICs). notwithstanding those units are the topic of a energetic learn attempt, the present literature is frequently both hugely technical or narrowly concentrated.

Additional resources for 3D IC Integration and Packaging (Electronics)

Example text

Download PDF sample

3D IC Integration and Packaging (Electronics) by John H. Lau

by Charles

Rated 4.10 of 5 – based on 16 votes